COG
which stands for “Chip On Glass”, (Anisotropicconductive Film) is directly bonded to the Glass. This installation method can greatly reduce the volume of the entire LCD module, lower cost than TAB mode, and easy to mass production, suitable for consumer electronic products used in LCD, such as: mobile phone, PDA, MP3 and other portable electronic products. This installation mode is promoted by IC manufacturers and is the main connection mode between IC and LCD.
COB
Is the abbreviation of English “Chip On Board”, that is, the Chip is bonded On the PCB, which can greatly reduce the module volume, and also reduce the cost in terms of price. As IC manufacturers are reducing QFP packages for LCD controls and related chips, the traditional SMT approach will be gradually replaced in future products.